A few days ago, we showed you the first teardown of the Samsung Galaxy Note 9 which revealed that the phone features a liquid cooling system just like the Samsung Galaxy S7 Edge. Now, a way more detailed teardown courtesy of TechInsights is showing us the most important single components of the new Korean flagship one by one. The model that you can see in the photos is the U.S. variant of the device carried by AT&T with Snapdragon 845 chipset inside. In Europe, there is another variant with Exynos 9810, so the processor is not the same on each variant.
There are several components that you can see in the photos below. The teardown has revealed the presence of an LPDDR4X SDRAM module Samsung K3UH6H60AM-AGCJ (6 GB of RAM) in a PoP (package-on-package). Inside the phone, as you can see, there is also a Samsung KLUDG4U1EA-B0C1 internal storage with a capacity of 128 GB eUFS 2.1. There is an NFC 80T17 controller made by NXP and a Wi-Fi and Bluetooth module Murata KM8509176. We can also see a Maxim MAX98512 audio amplifier, a Broadcom AFEM-9096 LTE module and the WDC9341 audio codec by Qualcomm.
All the camera sensors have been separated from the rest of the phones, highlighting a rear dual camera with 12 MP resolutions, OIS and variable apertures (it is possible to use f/1.5 and f/2.4), as well as an 8 MP front camera with f/1.7 aperture. A dual SIM tray is placed on the upper side of the phone: Samsung Galaxy Note 9 exists in both a single SIM and a dual SIM variant. The dual SIM one has a hybrid slot which can also be used as an expansion slot if you don’t use a second SIM. And obviously, there is the liquid cooling system that we mentioned above. However, the internals are not so different from the ones of the Note 8.
You can check out the detailed teardown from here!